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Upgrade to 13th Gen intel® Core™ Processors
Power your AIoT with cutting-edge Advantech IPC |
13th Gen Intel® Core™ processors feature a performance hybrid architecture with up to 24 cores, 32 threads, DDR5-5600 memory, and PCIe 5.0/4.0 supported. It boosts computing performance significantly, enhancing bandwidth, expandability, and connectivity for simultaneous and compute-intensive applications, making Advantech IPCs ideal upgrades for smart factory and machine automation, machine vision, transportation, and edge AI applications.
Advantech launches a wave of upgrades with 13th Gen Intel® Core™ processors in 2023, including industrial ATX motherboards,...View More |
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Rackmount / Tower IPC |
Advantech rackmount IPCs and tower IPCs are configurable industrial computers, which can be equipped with a wide range of function blocks, expansion boards, chassis form factors, and high-performance modules that can withstand heavy loading applications. |
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AIMB-788 |
• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 & Pentium®/
Celeron®processor.
• Four DIMM sockets up to 128 GB
DDR4 3200
• 1 x PCIe x16 (Gen4), 1 x PCIe x8,
3 x PCIe x4 and 2 x PCI slots.
• Advantech WISE-DeviceOn+iBMC
out-of-band remote management
solution. |
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AIMB-708 |
• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 & Pentium®/
Celeron®processor.
• Two DIMM sockets up to 64GB
DDR4 3200.
• 1 x PCIe x16 (Gen4), 2 x PCIe x4,
and 4 x PCI slots.
• Application upgrade with the latest
technology and legacy
expandability. |
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ASMB-788 |
• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 processors.
• Four DIMM sockets up to 128 GB
ECC/Non-ECC DDR5 5600.
• 1 x PCIe x16 (Gen 5), 4 x PCIe x4
(3x Gen4, 1x Gen3), and 2 x PCI
slots.
• Optimized placement with positive
air flow design. |
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ASMB-588 |
• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 processors.
• Four DIMM sockets up to 128 GB
ECC/Non-ECC DDR5 5600.
• 1 x PCIe x16 (Gen5) and 2 x PCIe
x4 (Gen4) slots.
• IPMI2.0 server-grade remote
control solution. |
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PCE-5133 |
• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 processors.
• Two DIMM sockets up to 64GB
ECC/Non-ECC DDR5 5600.
• 3 x displays - VGA &
DVI-D/DP/HDMI, 2 x GbE LAN up
to 1G, up to 8 x USB 3.2, 2 x COM,
1 x NVMe M.2 and 6 x SATA.
• Wide-range selection of expansion
backplanes for various
applications. |
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PCE-5033 |
• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 processors.
• Two DIMM sockets up to 64GB
DDR5 5600.
• 3 x displays - VGA &
DVI-D/DP/HDMI, 2 x GbE LAN up
to 2.5G, 4 x USB 3.2, 2 x COM and
4 x SATA.
• Wide-range selection of expansion
backplanes for various
applications. |
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Industrial Chassis |
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• Lockable door for enhanced security • Supports cabinet and rack mounting
• Front or rear I/O for easy cabling |
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ACP-4340 |
• Premium 4U chassis with
self-diagnosis capabilities
• 4 x hot-swappable 3.5”/2.5”
storage trays |
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ACP-2020G |
• Tool-less card cage for GPU card
Thermal design for 350W GPU
card
• Built in 850W 80 Plus Platinum
single power supply |
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IPC-7130 |
• Premium tower chassis with
self-diagnosis capabilities
• 2 x hot-swappable 3.5”/2.5”
storage trays, quiet fan |
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IPC-7120 |
• With front I/O interface and four to
seven expansion slots
• Shockproof drive bay for one 5.25"
ODD and two 3.5" HDDs |
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• Small footprint for limited space
• User-friendly design to decrease maintenance time |
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Modular IPC |
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High-performance expandable Modular IPC with optional expansion modules - Advantech i-Module, iDoor, and Flex I/O kits - the premium choice for diverse yet demanding applications. |
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• Fanless design for dusty or high vibration harsh
environments
• Compact size for small cabinet or limited mounting space
• Modular design with more add-on I/Os in the same size |
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MIC-770 V3 |
• 12th/13th Gen. Intel® Core™ i9/i7/i5/i3 processors.
• Two DIMM sockets up to 64GB DDR5 5600
(R680E SKU supports ECC).
• Expansion supported via Advantech i-Modules.
• Fanless and wide operating temperature (-20 ~ 60 °C). |
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Compact IPC |
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A compact system equipped with multiple expansion slots for integrating diverse add-on cards to support industrial equipment manufacturing applications. |
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• 12th/13th Gen. Intel® Core™
i9/i7/i5/i3 processors.
• Two DIMM sockets up to 64GB
DDR5 5600.
• 2 x displays – VGA/HDMI, 2 x GbE
LAN (one support 2.5G), 8 x USB
3.2/2.0, 2 x COM and 1 x NVMe
M.2 for Q670E SKU and iDoor
support.
• Bundled sale with compact
chassis IPC-220/240/242 and
energy efficiency ErP support.
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• Compact design for limited space in fields.
• High CPU performance for edge
computing and compact controller.
• Multiple basic automation I/O to
connect various devices.
• Support 5 VDC/12 VDC-2A power
output for an external device.
• Flexible 2 or 4 PCIe/PCI expansion
slots and swappable 2.5”
HDD/SSD drive bay.
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Designed for central control rooms in substations and industrial automation requiring industrial-grade design, longevity support, silent operation, and low noise (34 dB max.) acoustics. |
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IPC-320 |
• 12th/13th Gen. Intel® Core™ i9/i7/i5/i3 processors.
• Two DIMM sockets up to 64 GB DDR4 3200.
• 2 x display - HDMI/DP, 2 x GbE LAN and 8 x USB 3.2/2.0.
• 1 x PCIe x16 (Gen4) and 1 x PCIe x4 slots.
• Quiet noise level compact tower IPC with 250W power
supply. |
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• Small form factor for limited installation space
• Operator-oriented industrial design for multi-display
interface
• Quiet and user-friendly system for control room
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Accelerator Server |
Proprietary server board ASMB-610V3 bundle with HPC-6120 short-depth edge accelerator server chassis, which offers compact design and expansion capability in small cabinet and rack mounting, suitable for machine automation and AI applications. |
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• Short-depth design supports small cabinet and rack
mounting
• Enriched expansion slots for multiple market
applications
• Front and rear I/O for easy cabling |
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ASMB-610V3+HPC-6120 |
• 12th/13th Gen. Intel® Core™ i9/i7/i5/i3 processors.
• Four DIMM sockets up to 128 GB ECC/Non-ECC
DDR5 5600.
• 1 x PCIe x16 (Gen5) or 2 x PCIe x8 (Gen5),
1 x PCIe x4 (Gen4), 1 x PCIe x4 (Gen4) with internal
slot.
• Bundled sale with HPC-6120 1U edge accelerator
server. |
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